TM

TM

A low-cost, low-power processor module

RM

RM

Small computer-on-module form factor for ARM based processors

ETX

ETX

Standardised computer-on-module form factor

COM Express

COM Express

Standardised computer-on-module form factor

Qseven

Qseven

Standardised computer-on-module form factor

The Computer-on-Module (or System-on-Module as some people call them) was born when the embedded computer industry realised the benefits of separating a single board computer into two distinct parts:

1. A Computer-on-Module (COM) containing all the core components needed for a bootable host computer – processor, SoC/North bridge/South bridge, memory and Flash, without the standard connectors for any input/output peripherals nor some of the signal conditioning. This module is usually the high technology component with very dense track, gap, etc and a high number of PCB layers. Once designed it can usually be applied to a large number of applications across many industries.

2. A host or carrier board that contains the interfaces, connectors and profile to meet the target product requirements. This board is usually relatively low technology (compared to the COM) with lower speed interfaces, larger track and gap distances and less PCB layers. This board can usually be designed quickly, thereby, when combined with the COM, a custom solution can be created and brought to market much more swiftly than a custom single board computer.

Computer-on-Modules (COM) offer the best of all worlds – an affordable yet customisable solution with a very fast time to market. The resulting COM and host board combination is a competitive, tailor-made yet upgradable embedded solution.

  • AQ7 BT

    Intel Bay Trail Windows Linux
    • Qseven Module
    • Intel® Atom™ E3800 series and N2807 processor
    • Onboard DDR3L 2GB Memory
    • Gigabit Ethernet x 1
    • 18/24-bit Single-Channel LVDS LCD/eDP, HDMI
    • High Definition Audio Interface, SATA x 2
    • USB2.0 x2, USB3.0 x1, GPIO 8-bit PCI-Express ?x1? x 3
    • Qseven rev2.0, 70mm x 70mm
  • COM BT

    Intel Bay Trail Windows Linux
    • COM Express 6 Module
    • Intel® Atom™ SoC series processor
    • DDR3L 1066/1333 MHz SODIMM x 1, up to 8GB
    • CRT, Up to 24-bit Dual-channel LVDS, DP/HDMI, eDP (optional)
    • High Definition Audio Interface, SATA 3.0Gb/s x 2
    • USB3.0 x 1, USB2.0 x 7
    • PCI-Express[x1]x 3
    • COM Express Compact Module, Pin-out Type 6, COM.0 Rev. 2.1
  • ETX CN700

    VIA Nano Windows
    • ETX 3.02 Compliant Computer-on-Module
    • 500MHz, 1GHz & 1GHz Nano Processor options
    • Wide range of peripherals including SATA
    • Fully compatible with existing ETX baseboards
    • Both ISA and PCI bus retained for protecting legacy IO
    • Supports LVDS LCD and analogue displays, optional TFT
    • Passive heat sink and heat spreader options
    • Compact Size – 114 x 95mm
  • ETX CN700 + ETX EVAL

    VIA Nano Windows
    • ETX 3.02 Compliant Computer-on-Module
    • 500MHz, 1GHz & 1GHz Nano Processor Options
    • Wide range of peripherals including SATA
    • Fully compatible with existing ETX baseboards
    • Both ISA and PCI bus retained for protecting legacy IO
    • Supports LVDS LCD and analogue displays, optional TFT
    • Passive heat sink and heat spreader options
    • ATX and AT Power supplies supported
  • NanoCOM BT

    Intel Bay Trail Windows Linux
    • NanoCOM Express – smallest COM Express form factor
    • Intel® Atom™ E3800 Product Family/Celeron® N2000 Series processor
    • Onboard DDR3L 2 GB Memory
    • Gigabit Ethernet x 1
    • 18/24-bit Single Channel LVDS LCDs, DDI x 1
    • High Definition Audio Interface, SATA x 2, eMMC (Optional)
    • USB2.0 x 6 + USB2.0/USB3.0 x 1, GPIO 8-bit, PCI-Express?x1?x 3
    • Nano Module Size, 84mm x 55mm , COM.0 Rev. 2.1
  • RM2

    Texas Instruments ARM A8 Windows Linux Capacitive Touch Resistive Touch
    • Single-Core ARM Cortex A8 processor
    • ARM NEON SIMD coprocessor
    • TMS320C64x+ Digital Signal Processor
    • POWERVR SGX™ Graphics Accelerator
    • Multiple GPIO (1.8V)
    • Multiple MCBSP (UARTs)
    • SPI, USB, HDQ, I2C, SD/MMC/SDIO
    • Camera Image Signal Processing
  • RM2 + HB3

    Texas Instruments ARM A8 OMAP Windows Linux Bluetooth WiFi Zigbee Capacitive Touch Resistive Touch
    • RM2 Development Platform
    • ARM Cortex A8 processor
    • ARM NEON SIMD coprocessor
    • DVI, HDMI, LCD, 3 x Video Capture
    • POWERVR SGX™ Graphics Accelerator
    • Dual LANs, USBs, RS232, CAN, I2C, SIM socket, Zigbee
    • SATA, uSD, SD
    • SPI, USB, HDQ, I2C, SD/MMC/SDIO
  • RM3

    NXP / Freescale ARM A9 Linux Android
    • Freescale iMX6 ARM Cortex A9 1GHz Dual / Quad-Core processor with Trust Zone
    • ARM NEON MPE (Media Processing Engine) coprocessor per core
    • 32KB Instruction Cache + 32KB Data Cache per core
    • 1GB/2GB 64 bit DDR3 RAM
    • 1GB SLC NAND Flash
    • Gigabit LAN, CAN, PCI-E, I2S, UARTs, SPI, I2C, GPIO and more
    • Dual HD displays (DVI/HDMI & LCD) supported concurrently and independently
    • 1 video camera/capture port – concurrent operation with dual video channels
  • RM3 + HB3

    NXP / Freescale ARM A9 Linux Android
    • RM3 Development Platform
    • Freescale iMX6 ARM Cortex A9 1GHz Dual / Quad-Core processor with Trust Zone
    • ARM NEON MPE (Media Processing Engine) coprocessor per core
    • 1GB/2GB 64 bit DDR3 RAM
    • 1GB SLC NAND Flash
    • Dual LAN, USB, RS232, CAN, I2C, SIM socket, Zigbee, PCI-E, I2S, SPI, GPIO and more
    • Dual HD displays (DVI/HDMI & LCD) supported concurrently and independently
    • DVI, HDMI, LCD, 3 x Video Capture
  • TM1

    Internet of Things Module

    NXP / Freescale ARM A9 Linux Android Bluetooth WiFi
    • NXP iMX6 ARM Cortex A9 single-core processor
    • ARM NEON coprocessor
    • Up to 1GB of Low Power DDR3 memory
    • MicroSD or eMMC storage devices
    • Wi-Fi & Bluetooth optional
    • Up to 60 GPIO lines with selectable 1.8 or 3.3 voltage levels
    • Extended operating temperature range
    • Android and Ubuntu Linux LTS operating systems supported