Home » Computer-on-Modules
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AQ7 BT
- Qseven Module
- Intel® Atom™ E3800 series and N2807 processor
- Onboard DDR3L 2GB Memory
- Gigabit Ethernet x 1
- 18/24-bit Single-Channel LVDS LCD/eDP, HDMI
- High Definition Audio Interface, SATA x 2
- USB2.0 x2, USB3.0 x1, GPIO 8-bit PCI-Express ?x1? x 3
- Qseven rev2.0, 70mm x 70mm
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COM BT
- COM Express 6 Module
- Intel® Atom™ SoC series processor
- DDR3L 1066/1333 MHz SODIMM x 1, up to 8GB
- CRT, Up to 24-bit Dual-channel LVDS, DP/HDMI, eDP (optional)
- High Definition Audio Interface, SATA 3.0Gb/s x 2
- USB3.0 x 1, USB2.0 x 7
- PCI-Express[x1]x 3
- COM Express Compact Module, Pin-out Type 6, COM.0 Rev. 2.1
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ETX CN700
- ETX 3.02 Compliant Computer-on-Module
- 500MHz, 1GHz & 1GHz Nano Processor options
- Wide range of peripherals including SATA
- Fully compatible with existing ETX baseboards
- Both ISA and PCI bus retained for protecting legacy IO
- Supports LVDS LCD and analogue displays, optional TFT
- Passive heat sink and heat spreader options
- Compact Size – 114 x 95mm
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ETX CN700 + ETX EVAL
- ETX 3.02 Compliant Computer-on-Module
- 500MHz, 1GHz & 1GHz Nano Processor Options
- Wide range of peripherals including SATA
- Fully compatible with existing ETX baseboards
- Both ISA and PCI bus retained for protecting legacy IO
- Supports LVDS LCD and analogue displays, optional TFT
- Passive heat sink and heat spreader options
- ATX and AT Power supplies supported
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NanoCOM BT
- NanoCOM Express – smallest COM Express form factor
- Intel® Atom™ E3800 Product Family/Celeron® N2000 Series processor
- Onboard DDR3L 2 GB Memory
- Gigabit Ethernet x 1
- 18/24-bit Single Channel LVDS LCDs, DDI x 1
- High Definition Audio Interface, SATA x 2, eMMC (Optional)
- USB2.0 x 6 + USB2.0/USB3.0 x 1, GPIO 8-bit, PCI-Express?x1?x 3
- Nano Module Size, 84mm x 55mm , COM.0 Rev. 2.1
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RM2
- Single-Core ARM Cortex A8 processor
- ARM NEON SIMD coprocessor
- TMS320C64x+ Digital Signal Processor
- POWERVR SGX™ Graphics Accelerator
- Multiple GPIO (1.8V)
- Multiple MCBSP (UARTs)
- SPI, USB, HDQ, I2C, SD/MMC/SDIO
- Camera Image Signal Processing
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RM2 + HB3
- RM2 Development Platform
- ARM Cortex A8 processor
- ARM NEON SIMD coprocessor
- DVI, HDMI, LCD, 3 x Video Capture
- POWERVR SGX™ Graphics Accelerator
- Dual LANs, USBs, RS232, CAN, I2C, SIM socket, Zigbee
- SATA, uSD, SD
- SPI, USB, HDQ, I2C, SD/MMC/SDIO
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RM3
- NXP i.MX6 ARM Cortex A9 1GHz Dual / Quad-Core processor with Trust Zone
- ARM NEON MPE (Media Processing Engine) coprocessor per core
- 32KB Instruction Cache + 32KB Data Cache per core
- 1GB/2GB 64 bit DDR3 RAM
- 1GB SLC NAND Flash
- Gigabit LAN, CAN, PCI-E, I2S, UARTs, SPI, I2C, GPIO and more
- Dual HD displays (DVI/HDMI & LCD) supported concurrently and independently
- 1 video camera/capture port – concurrent operation with dual video channels
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RM3 + HB3
- RM3 Development Platform
- NXP i.MX6 ARM Cortex A9 1GHz Dual / Quad-Core processor with Trust Zone
- ARM NEON MPE (Media Processing Engine) coprocessor per core
- 1GB/2GB 64 bit DDR3 RAM
- 1GB SLC NAND Flash
- Dual LAN, USB, RS232, CAN, I2C, SIM socket, Zigbee, PCI-E, I2S, SPI, GPIO and more
- Dual HD displays (DVI/HDMI & LCD) supported concurrently and independently
- DVI, HDMI, LCD, 3 x Video Capture
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TM1
Internet of Things Module
- NXP iMX6 ARM Cortex A9 single-core processor
- ARM NEON coprocessor
- 1GB of Low Power DDR3 memory
- MicroSD or eMMC storage devices
- Wi-Fi & Bluetooth optional
- Up to 60 GPIO lines with selectable 1.8 or 3.3 voltage levels
- Extended operating temperature range
- Android and Ubuntu Linux LTS operating systems supported